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TRS3227EIDBR - Texas Instruments

Description: 3-V to 5.5-V Single-Channel RS-232 Line Driver/Receiver With +/-15-kV ESD Protection

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TRS3227EIDBR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DB (R-PDSO-G16)
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TRS3227EIDBR - Texas Instruments  - 3D model - Small Outline Packages - DB (R-PDSO-G16)
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TRS3227EIDBR Details

  • Manufacturer Part Number:

    TRS3227EIDBR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SSOP-16

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES AT 5V

  • Differential Output:

    NO

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000001 A

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232-F; TIA-232-F; V.28

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    6.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    10 V

  • Output Low Current-Max:

    0.0016 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    2 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

TRS3227EIDBR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the analog and digital traces separate to minimize noise. Additionally, it's recommended to use a 10uF capacitor between VCC and GND, and to keep the input and output traces as short as possible.
  • The TRS3227EIDBR has a built-in thermal shutdown feature that shuts down the device when the junction temperature exceeds 150°C. To handle this, ensure good thermal design and heat dissipation, and consider adding thermal monitoring and shutdown circuitry to prevent damage to the device.
  • Texas Instruments recommends using 10uF capacitors for both input and output, with a voltage rating of at least 10V. The capacitors should be placed as close to the device as possible to minimize inductance and ensure proper decoupling.
  • To ensure EMC, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, ensure that the PCB layout is designed to minimize radiation and susceptibility to electromagnetic interference.
  • Texas Instruments recommends a power-up sequence of VCC first, followed by VIN, and a power-down sequence of VIN first, followed by VCC. This ensures that the device is properly biased and minimizes the risk of latch-up or damage.

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TRS3227EIDBR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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