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TRSF3221ECPW - Texas Instruments

Description: RS-232 Interface IC 3V-5.5V Sgl-Ch RS232 1Mbit Line Drvr/Rcvr

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TRSF3221ECPW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW0016A
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TRSF3221ECPW - Texas Instruments  - 3D model - Small Outline Packages - PW0016A
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TRSF3221ECPW Details

  • Manufacturer Part Number:

    TRSF3221ECPW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 5V

  • Differential Output:

    NO

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000001 A

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    10 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.0016 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TRSF3221ECPW Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize EMI.
  • The TRSF3221ECPW has a thermal pad that must be connected to a thermal ground plane on the PCB to dissipate heat. A thermal via array or a thermal pad with a large copper area can be used to improve heat dissipation. Additionally, the device's thermal resistance (RθJA) should be considered when designing the system's thermal management.
  • The recommended input capacitance for the TRSF3221ECPW is 0.1 μF to 1 μF, depending on the specific application and operating frequency. A larger input capacitance can help to filter out noise and improve the device's power supply rejection ratio (PSRR).
  • To ensure the device's output is stable and accurate, it is recommended to use a stable input voltage, minimize noise and EMI, and use a low-ESR output capacitor. Additionally, the device's output voltage should be filtered using a low-pass filter or a π-filter to remove high-frequency noise.
  • The TRSF3221ECPW has a soft-start feature that helps to reduce inrush current during power-up. During power-down, the device's output voltage will decay slowly to prevent any voltage spikes or oscillations. The device's power-up and power-down sequences should be carefully considered when designing the system's power management.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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