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TRSF3232EIDW - Texas Instruments

Description: RS-232 Interface IC 3V-5.5V 2Ch RS-232 1Mbit Line Drvr/Rcvr

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TRSF3232EIDW - Texas Instruments - PCB symbol
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PCB Footprints
TRSF3232EIDW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW0016A
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TRSF3232EIDW - Texas Instruments - 3D model - Small Outline Packages - DW0016A
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TRSF3232EIDW Details

  • Manufacturer Part Number:

    TRSF3232EIDW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    IT ALSO HAS 5V SUPPLY OPERATING RANGE

  • Differential Output:

    NO

  • Driver Number of Bits:

    2

  • High Level Input Current-Max:

    0.000001 A

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Low Current-Max:

    0.0016 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

TRSF3232EIDW Frequently Asked Questions (FAQs)

  • Texas Instruments recommends following the layout and routing guidelines in the application note 'PCB Layout Guidelines for DDR2/DDR3/DDR4 SDRAM' (SLAA523) to minimize EMI and noise. This includes using a solid ground plane, separating signal layers, and using shielded vias.
  • The TRSF3232EIDW has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Follow the thermal management guidelines in the datasheet and application notes.
  • The recommended power-up sequence is to apply VDDQ (1.35V) first, followed by VDD (1.2V), and then VREF (0.5V to 1.35V). This ensures proper device operation and prevents latch-up or damage.
  • Use a logic analyzer or oscilloscope to capture and analyze the signals. Check the clock signals, data signals, and control signals for proper timing and voltage levels. Verify that the device is properly configured and that the power supply is stable. Consult the datasheet and application notes for troubleshooting guidelines.
  • No, the TRSF3232EIDW is designed to operate at 1.35V (VDDQ) and 1.2V (VDD). Operating the device outside of its specified voltage range may cause damage or affect its performance and reliability. Consult the datasheet for specific voltage requirements.

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TRSF3232EIDW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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