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TS2012EIJT - STMicroelectronics

Description: Filter-free stereo 2 x 2.8 W class D audio power amplifier

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TS2012EIJT - STMicroelectronics - PCB symbol
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PCB Footprints
TS2012EIJT - STMicroelectronics PCB footprint - BGA - BGA - Flip Chip 16
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3D Models
TS2012EIJT - STMicroelectronics - 3D model - BGA - Flip Chip 16
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TS2012EIJT Details

  • Manufacturer Part Number:

    TS2012EIJT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    2.10 X 2.10 MM, 0.50 MM PITCH, ROHS COMPLIANT, FLIP CHIP PACKAGE, 16 PIN

  • Pin Count:

    16

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    S-PBGA-B16

  • Length:

    2.1 mm

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    2.5 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA16,4X4,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    2.1 mm

TS2012EIJT Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermal interface material, and keeping the device within its recommended operating temperature range.
  • Although the datasheet specifies the recommended operating voltage range, it is essential to note that the maximum allowable voltage on the input pins is 5.5V, exceeding which may cause permanent damage to the device.
  • To troubleshoot issues with the device not switching properly, check the input voltage levels, ensure proper signal integrity, and verify that the device is not overheating. Also, check for any potential layout or soldering issues that may be affecting the device's performance.
  • Yes, the TS2012EIJT is a sensitive device and requires proper ESD protection measures during handling, storage, and assembly. Follow standard ESD precautions, such as using an ESD wrist strap, ESD mat, and ESD-safe packaging materials.

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TS2012EIJT Overview

Use the download button to access the TS2012EIJT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TS201, or try a keyword search, such as Audio/Video Amplifiers

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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