TS3DS26227YZTR - Texas Instruments

TS3DS26227YZTR Details

• Manufacturer Part Number:

  TS3DS26227YZTR

• Brand Name:

  Texas Instruments

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  End Of Life

• Part Package Code:

  BGA

• Pin Count:

  12

• Country Of Origin:

  Mainland China

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.90

• Manufacturer:

  Texas Instruments

• YTEOL:

  15

• Additional Feature:

  2:1 SPDT

• Analog IC - Other Type:

  SPDT

• Bandwidth-Nom:

  800 MHz

• Input Voltage-Max:

  4.6 V

• JESD-30 Code:

  R-XBGA-B12

• JESD-609 Code:

  e1

• Length:

  1.87 mm

• Moisture Sensitivity Level:

  1

• Number of Channels:

  2

• Number of Functions:

  2

• Number of Terminals:

  12

• Off-state Isolation-Nom:

  40 dB

• On-state Resistance Match-Nom:

  0.2 Ω

• On-state Resistance-Max (Ron):

  7 Ω

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Output:

  COMMON OUTPUT

• Package Body Material:

  UNSPECIFIED

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA12,3X4,20

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  0.625 mm

• Supply Current-Max (Isup):

  0.02 mA

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2.3 V

• Supply Voltage-Nom (Vsup):

  2.5 V

• Surface Mount:

  YES

• Switch-off Time-Max:

  5 ns

• Switch-on Time-Max:

  13 ns

• Switching:

  BREAK-BEFORE-MAKE

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  1.37 mm