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TS3DV20812RHHR - Texas Instruments

Description: Texas Instruments TS3DV20812RHHR, Analogue Switch Quad:1 x 2 20Gbps, 2.25 → 3.6 V, 36-Pin VQFN

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PCB Footprints
TS3DV20812RHHR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RHH (S-PVQFN-N36)
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3D Models
TS3DV20812RHHR - Texas Instruments  - 3D model - Quad Flat No-Lead - RHH (S-PVQFN-N36)
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TS3DV20812RHHR Details

  • Manufacturer Part Number:

    TS3DV20812RHHR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    36

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Input Voltage-Max:

    3.6 V

  • JESD-30 Code:

    S-PQCC-N36

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Normal Position:

    NO/NC

  • Number of Channels:

    11

  • Number of Functions:

    4

  • Number of Terminals:

    36

  • On-state Resistance Match-Nom:

    0.4 Ω

  • On-state Resistance-Max (Ron):

    6 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC36,.25SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Signal Current-Max:

    0.128 A

  • Supply Current-Max (Isup):

    0.5 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.25 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    15 ns

  • Switch-on Time-Max:

    14 ns

  • Switching:

    MAKE-BEFORE-BREAK

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

TS3DV20812RHHR Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow Texas Instruments' recommended PCB layout guidelines, including using a solid ground plane, minimizing trace lengths, and using thermal vias to dissipate heat. A thermal pad on the bottom of the package can also be used to improve heat dissipation.
  • To ensure signal integrity, use controlled impedance traces, minimize trace lengths, and use signal termination resistors as recommended in the datasheet. Additionally, use a common mode filter or a differential filter to reduce electromagnetic interference (EMI) and improve signal quality.
  • The recommended power sequencing is to power up the VCC pin first, followed by the VCCA pin. The voltage ramp-up procedure should be slow and controlled, with a recommended rate of 1-2 ms/V to prevent latch-up and ensure reliable operation.
  • To prevent electrostatic discharge (ESD) damage, use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Additionally, follow proper handling and storage procedures to prevent ESD damage. For latch-up prevention, ensure that the power supply voltage is within the recommended range and use a latch-up protection circuit if necessary.
  • The thermal design considerations include ensuring good thermal conductivity between the device and the PCB, using thermal vias, and providing adequate airflow. To calculate the junction temperature, use the thermal resistance (RθJA) and the power dissipation (PD) values provided in the datasheet, and follow the equation: Tj = Ta + (RθJA * PD), where Ta is the ambient temperature.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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