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TS3DV416DGVR - Texas Instruments

Description: Multi-Channel Differential Switch/Multiplexer Targeting DVI/HDMI Applications

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TS3DV416DGVR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGV (R-PDSO-G48)
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TS3DV416DGVR - Texas Instruments  - 3D model - Small Outline Packages - DGV (R-PDSO-G48)
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TS3DV416DGVR Details

  • Manufacturer Part Number:

    TS3DV416DGVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    3DV

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    9.7 mm

  • Load Capacitance (CL):

    10 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Max I(ol):

    0.064 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    8

  • Number of Ports:

    3

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.6 mA

  • Prop. Delay@Nom-Sup:

    11.5 ns

  • Propagation Delay (tpd):

    11.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TS3DV416DGVR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-frequency design practices, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines to ensure signal integrity.
  • To minimize noise and EMI, use proper shielding, grounding, and decoupling techniques. Ensure that the device is placed in a quiet area of the board, away from high-frequency sources. Additionally, use ferrite beads or common-mode chokes to filter out high-frequency noise.
  • The TS3DV416DGVR is rated for operation from -40°C to 125°C. However, it's essential to consider the thermal design and ensure proper heat dissipation to maintain reliable operation within the specified temperature range.
  • The TS3DV416DGVR can be programmed using the I2C interface. Texas Instruments provides a detailed programming guide in the datasheet, including register maps and programming examples. Additionally, you can use the TI-provided software development kits (SDKs) and evaluation modules to simplify the programming process.
  • The recommended power-up sequence is to apply the power supply voltage (VCC) before the input signals. Ensure that the power supply is stable and within the specified voltage range before applying input signals to the device.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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