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TS3DV421DGVR - Texas Instruments

Description: Multi-Channel Differential Switch/Multiplexer Targeting DVI/HDMI Applications

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TS3DV421DGVR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGV (R-PDSO-G48)
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TS3DV421DGVR - Texas Instruments  - 3D model - Small Outline Packages - DGV (R-PDSO-G48)
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TS3DV421DGVR Details

  • Manufacturer Part Number:

    TS3DV421DGVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    AUDIO/VIDEO SWITCH

  • Input Voltage-Max:

    3.6 V

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO/NC

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Off-state Isolation-Nom:

    50 dB

  • On-state Resistance-Max (Ron):

    20 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.25,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max (Isup):

    0.45 mA

  • Supply Voltage-Max (Vsup):

    2.1 V

  • Supply Voltage-Min (Vsup):

    1.5 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    5 ns

  • Switch-on Time-Max:

    9 ns

  • Switching:

    MAKE-BEFORE-BREAK

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TS3DV421DGVR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-frequency design practices, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines to ensure signal integrity.
  • The TS3DV421DGVR has a high power dissipation, so it's crucial to implement proper thermal management. This can be achieved by using a heat sink, thermal vias, and a thermal pad on the PCB. Ensure good airflow and avoid blocking the airflow around the device.
  • The recommended input termination is 50 ohms, and the output termination should be matched to the load impedance. For example, if the load impedance is 50 ohms, the output termination should also be 50 ohms to ensure maximum power transfer and minimize reflections.
  • The TS3DV421DGVR requires a specific biasing scheme to operate correctly. Ensure that the VCC and VEE pins are properly biased, and the input and output pins are terminated correctly. Refer to the datasheet for the recommended biasing scheme and voltage levels.
  • The TS3DV421DGVR is a high-speed, low-power, and low-distortion voltage-controlled amplifier (VCA) suitable for various applications, including audio and video signal processing, data acquisition, and medical devices. It's also used in professional audio equipment, such as audio mixers and effects processors.

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TS3DV421DGVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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