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TS3DV520ERHUR - Texas Instruments

Description: Multi-channel differential switch & multiplexer targeting DVI & HDMI applications

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PCB Footprints
TS3DV520ERHUR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RHU (R-PWQFN-N56)
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3D Models
TS3DV520ERHUR - Texas Instruments  - 3D model - Quad Flat No-Lead - RHU (R-PWQFN-N56)
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TS3DV520ERHUR Details

  • Manufacturer Part Number:

    TS3DV520ERHUR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    56

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    AUDIO/VIDEO SWITCH

  • Input Voltage-Max:

    5.5 V

  • JESD-30 Code:

    R-PQCC-N56

  • JESD-609 Code:

    e4

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    2

  • Normal Position:

    NO

  • Number of Channels:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Off-state Isolation-Nom:

    39 dB

  • On-state Resistance Match-Nom:

    0.4 Ω

  • On-state Resistance-Max (Ron):

    6 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.19X.43,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Signal Current-Max:

    0.1 A

  • Supply Current-Max (Isup):

    0.5 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    9 ns

  • Switch-on Time-Max:

    15 ns

  • Switching:

    MAKE-BEFORE-BREAK

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

TS3DV520ERHUR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using impedance-controlled traces to ensure signal integrity.
  • Proper power supply decoupling is crucial. Use a low-ESR capacitor (e.g., 0.1 μF) close to the device, and consider adding a 10 μF capacitor in parallel to filter out noise. Ensure the power supply voltage is within the recommended range (1.71 V to 1.89 V).
  • The TS3DV520ERHUR supports data transfer rates up to 10 Gbps. However, the actual achievable data rate depends on the system design, PCB layout, and signal integrity. Ensure proper signal termination, impedance matching, and signal conditioning to achieve the highest possible data transfer rate.
  • The TS3DV520ERHUR has a maximum junction temperature of 125°C. Ensure good airflow, use a heat sink if necessary, and follow proper thermal design practices to keep the device within the recommended operating temperature range (–40°C to 85°C).
  • To ensure signal integrity, consider the following: use impedance-controlled traces, minimize trace lengths, avoid vias and stubs, use differential signaling, and add signal termination resistors as needed. Also, ensure the PCB material and stack-up are suitable for high-speed signals.

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TS3DV520ERHUR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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