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TS3L110PW - Texas Instruments

Description: Quad SPDT High-Bandwidth 10/100 Base-T Lan Switch Differential 8 to 4 Multiplexer/Demultiplexer

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TS3L110PW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW (R-PDSO-G16)
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TS3L110PW - Texas Instruments  - 3D model - Small Outline Packages - PW (R-PDSO-G16)
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TS3L110PW Details

  • Manufacturer Part Number:

    TS3L110PW

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    SPDT

  • Bandwidth-Nom:

    500 MHz

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    4

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    28 dB

  • On-state Resistance Match-Nom:

    0.9 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Signal Current-Max:

    0.128 A

  • Supply Current-Max (Isup):

    1.5 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    5 ns

  • Switch-on Time-Max:

    7 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TS3L110PW Frequently Asked Questions (FAQs)

  • A good PCB layout for the TS3L110PW involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power-on and power-off of the TS3L110PW, it's recommended to use a soft-start circuit to limit the inrush current during power-on, and to use a power-down sequence that follows the recommended timing diagram in the datasheet.
  • The TS3L110PW has a thermal pad that must be connected to a thermal plane on the PCB to ensure proper heat dissipation. The device can operate up to 125°C, but it's recommended to keep the junction temperature below 100°C for optimal reliability.
  • To troubleshoot issues with the TS3L110PW, start by checking the power supply voltage, input and output signals, and the device's thermal performance. Use an oscilloscope to check for signal integrity and noise, and consult the datasheet and application notes for guidance on troubleshooting common issues.
  • Yes, the TS3L110PW is qualified for automotive and industrial applications, and is suitable for use in high-reliability and high-temperature environments. However, it's recommended to consult the datasheet and application notes for specific guidance on using the device in these types of applications.

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TS3L110PW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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