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TS3L110PWE4 - Texas Instruments

Description: TEXAS INSTRUMENTS - TS3L110PWE4 - Analog Multiplexer / Demultiplexer, 4 Circuits, 8 ohm, 700 µA, 3V to 3.6V, TSSOP-16

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TS3L110PWE4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW
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TS3L110PWE4 - Texas Instruments  - 3D model - Small Outline Packages - PW
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TS3L110PWE4 Details

  • Manufacturer Part Number:

    TS3L110PWE4

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    GREEN, PLASTIC, TSSOP-16

  • Pin Count:

    16

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    28 dB

  • On-state Resistance Match-Nom:

    0.9 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Signal Current-Max:

    0.128 A

  • Supply Current-Max (Isup):

    1.5 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    5 ns

  • Switch-on Time-Max:

    7 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TS3L110PWE4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines for the input and output signals.
  • The TS3L110PWE4 requires a bias voltage of 2.5V to 5.5V on the VCC pin. Ensure that the bias voltage is stable and within the recommended range. Additionally, the input signal should be AC-coupled to the device, and the output signal should be terminated with a 50-ohm load to ensure proper operation.
  • The TS3L110PWE4 is specified to operate up to 1.5 GHz, but it can be used at higher frequencies with some degradation in performance. However, it's recommended to consult with Texas Instruments or perform characterization tests to determine the device's performance at frequencies above 1.5 GHz.
  • The TS3L110PWE4 has a maximum junction temperature of 150°C. Ensure that the device is mounted on a PCB with a good thermal conductivity, and consider using thermal vias or a heat sink to dissipate heat. Additionally, follow proper soldering and assembly techniques to ensure good thermal contact between the device and the PCB.
  • The recommended input signal amplitude for the TS3L110PWE4 is typically in the range of 100 mVpp to 1 Vpp. However, the device can handle input signals up to 2 Vpp, but with some degradation in performance. It's recommended to consult the datasheet or perform characterization tests to determine the optimal input signal amplitude for a specific application.

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TS3L110PWE4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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