Part Image

TS3L301DGGR - Texas Instruments

Description: 16-Bit to 8-Bit SPDT Gigabit LAN Switch with Low and Flat On-State Resistance

Download TS3L301DGGR Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
TS3L301DGGR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG (R-PDSO-G48)
click to zoom
3D Models
TS3L301DGGR - Texas Instruments  - 3D model - Small Outline Packages - DGG (R-PDSO-G48)
click to zoom

TS3L301DGGR Details

  • Manufacturer Part Number:

    TS3L301DGGR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Bandwidth-Nom:

    900 MHz

  • Input Voltage-Max:

    5.5 V

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    12.5 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NC

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Off-state Isolation-Nom:

    39 dB

  • On-state Resistance Match-Nom:

    1.2 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Signal Current-Max:

    0.128 A

  • Supply Current-Max (Isup):

    0.6 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    8.5 ns

  • Switch-on Time-Max:

    11.5 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

TS3L301DGGR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TS3L301DGGR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • The TS3L301DGGR requires a single 1.8V to 3.6V power supply. Ensure the power supply is stable and noise-free. Power sequencing is not critical, but it's recommended to power the device after the input signals are stable. Consult the datasheet for specific power-up and power-down sequencing guidelines.
  • The TS3L301DGGR supports data rates up to 3.2 Gbps and cable lengths up to 10 meters, depending on the specific application and signal quality. Consult the datasheet and application notes for specific guidance on data rate and cable length limitations.
  • The TS3L301DGGR has integrated ESD protection diodes. However, additional external ESD protection may be necessary depending on the application. The internal ESD diodes can withstand up to ±2 kV human-body model (HBM) and ±200 V machine model (MM) ESD events.
  • The TS3L301DGGR has a maximum junction temperature of 150°C. Ensure good thermal conductivity between the device and the PCB, and consider using thermal vias or heat sinks for high-power or high-temperature applications. Consult the datasheet for thermal resistance and power dissipation guidelines.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TS3L301DGGR Overview

Use the download button to access the TS3L301DGGR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TS3L3, or try a keyword search, such as Multiplexers or Switches

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to TS3L301DGGR

Showing 0 results

TS3L301DGGR Alternates

Showing results

Image Part Number Model
Part Image TS3L301DGVRG4 Texas Instruments

Differential Multiplexer, 1 Func, 8 Channel, CMOS, PDSO48

Part Image TS3L301DGGRG4 Texas Instruments

Differential Multiplexer, 1 Func, 8 Channel, CMOS, PDSO48

Part Image TS3L301DGG Texas Instruments

Differential Multiplexer, 1 Func, 8 Channel, CMOS, PDSO48

Part Image TS3L301DGGRE4 Texas Instruments

Differential Multiplexer, 1 Func, 8 Channel, PDSO48

Part Image TS3L301DGGG4 Texas Instruments

Differential Multiplexer, 1 Func, 8 Channel, PDSO48

For a full list of alternate parts for TS3L301DGGR, check out Findchips.com