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TS3L301DGVR - Texas Instruments

Description: 16-Bit to 8-Bit SPDT Gigabit LAN Switch with Low and Flat On-State Resistance

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TS3L301DGVR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGV (R-PDSO-G48)
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3D Models
TS3L301DGVR - Texas Instruments  - 3D model - Small Outline Packages - DGV (R-PDSO-G48)
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TS3L301DGVR Details

  • Manufacturer Part Number:

    TS3L301DGVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Bandwidth-Nom:

    900 MHz

  • Input Voltage-Max:

    5.5 V

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NC

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Off-state Isolation-Nom:

    39 dB

  • On-state Resistance Match-Nom:

    1.2 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.25,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Signal Current-Max:

    0.128 A

  • Supply Current-Max (Isup):

    0.6 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    8.5 ns

  • Switch-on Time-Max:

    11.5 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TS3L301DGVR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TS3L301DGVR involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help reduce EMI.
  • The TS3L301DGVR requires a single 1.8V to 3.6V power supply. It's recommended to power the device with a clean, low-noise power source. Power sequencing is not critical, but it's recommended to power the device after the input signals are stable.
  • The TS3L301DGVR can achieve data rates up to 100 Mbps. However, the actual data rate may be limited by the signal quality, PCB layout, and the quality of the input signals. It's recommended to use a signal integrity analysis tool to ensure the signal quality meets the device's requirements.
  • The TS3L301DGVR has a maximum junction temperature of 150°C. To ensure reliable operation, it's recommended to keep the device temperature below 125°C. A thermal pad on the bottom of the package helps to dissipate heat. A heat sink or a thermal interface material can be used to further reduce the device temperature.
  • The TS3L301DGVR has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. It's also recommended to use ESD protection devices, such as TVS diodes, on the input signals to protect the device from ESD damage.

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TS3L301DGVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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