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TS3USB30EDGSR - Texas Instruments

Description: High-Speed USB 2.0 1:2 Mux/Demux Switch With Single Enable and ESD Protection

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PCB Footprints
TS3USB30EDGSR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0010A
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3D Models
TS3USB30EDGSR - Texas Instruments  - 3D model - Small Outline Packages - DGS0010A
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TS3USB30EDGSR Details

  • Manufacturer Part Number:

    TS3USB30EDGSR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Bandwidth-Nom:

    900 MHz

  • Input Voltage-Max:

    4.3 V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NC

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    40 dB

  • On-state Resistance Match-Nom:

    0.35 Ω

  • On-state Resistance-Max (Ron):

    10 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.1 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    4.3 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    25 ns

  • Switch-on Time-Max:

    30 ns

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TS3USB30EDGSR Frequently Asked Questions (FAQs)

  • The TS3USB30EDGSR can support data rates up to 5 Gbps, making it suitable for high-speed USB 3.0 applications.
  • The TS3USB30EDGSR has built-in signal conditioning and jitter filtering capabilities to ensure signal integrity and minimize jitter, ensuring reliable data transmission.
  • Yes, the TS3USB30EDGSR is backward compatible with USB 2.0 and can operate at lower speeds when necessary, making it a versatile solution for various USB applications.
  • The TS3USB30EDGSR has a low power consumption of around 100 mW, making it suitable for power-sensitive applications.
  • The TS3USB30EDGSR has built-in hot swap detection and supports plug-and-play functionality, allowing for seamless device connection and disconnection.

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TS3USB30EDGSR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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