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TS4601BEIJT - STMicroelectronics

Description: High performance stereo headphone amplifier with capacitorless outputs and I²C bus interface

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TS4601BEIJT - STMicroelectronics - PCB symbol
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PCB Footprints
TS4601BEIJT - STMicroelectronics PCB footprint - Other - Other - 16-FlipChip (2.1x2.1)
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3D Models
TS4601BEIJT - STMicroelectronics - 3D model - Other - 16-FlipChip (2.1x2.1)
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TS4601BEIJT Details

  • Manufacturer Part Number:

    TS4601BEIJT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    16 PIN

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • JESD-30 Code:

    S-PBGA-B16

  • Length:

    2.1 mm

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA16,4X4,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Supply Current-Max:

    7 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.9 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    2.1 mm

TS4601BEIJT Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow to keep the device temperature within the specified range.
  • STMicroelectronics recommends using a ceramic capacitor with a value between 1uF to 10uF, depending on the specific application requirements. A low-ESR capacitor with an X7R or X5R dielectric is recommended to minimize voltage ripple and ensure stable operation.
  • To troubleshoot issues with the TS4601BEIJT, start by verifying the input voltage, current, and PCB layout. Check for any signs of overheating, such as excessive temperature or thermal shutdown. Use oscilloscopes and voltage meters to measure the output voltage and current. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Operating the TS4601BEIJT at a lower input voltage than recommended may result in reduced output voltage, increased dropout voltage, and decreased efficiency. It may also lead to instability, oscillations, or even device failure. Always ensure the input voltage meets the recommended minimum rating to guarantee reliable operation.

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TS4601BEIJT Overview

Use the download button to access the TS4601BEIJT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TS460, or try a keyword search, such as Audio/Video Amplifiers

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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