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TS482IDT - STMicroelectronics

Description: STMICROELECTRONICS - TS482IDT - Audio Power Amplifier, 67.5 mW, 2 Channel, 2V to 5.5V, SOIC, 8 Pins

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TS482IDT - STMicroelectronics - PCB symbol
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PCB Footprints
TS482IDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-8_3
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TS482IDT - STMicroelectronics - 3D model - Small Outline Packages - SO-8_3
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TS482IDT Details

  • Manufacturer Part Number:

    TS482IDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    LEAD FREE, SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.107 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    7.2 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3.9 mm

TS482IDT Frequently Asked Questions (FAQs)

  • A good PCB layout for the TS482IDT involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing the decoupling capacitors close to the device. Additionally, it's recommended to use a shielded enclosure and to keep the device away from other noise-sensitive components.
  • To ensure proper power-up and configuration, make sure to follow the recommended power-up sequence, connect the VCC pin to a stable 3.3V or 5V power supply, and configure the device using the I2C interface according to the datasheet. Also, ensure that the reset pin is properly connected and that the device is not exposed to excessive voltage or current.
  • The TS482IDT has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat dissipation, such as using a heat sink or a thermal pad, and to avoid exposing the device to high ambient temperatures or excessive power dissipation.
  • To troubleshoot issues with the TS482IDT, start by checking the power supply and clock signals, then verify the I2C communication and configuration. Use a logic analyzer or oscilloscope to debug the signals, and consult the datasheet and application notes for guidance. If issues persist, contact STMicroelectronics support for further assistance.
  • Yes, the TS482IDT is a sensitive device and requires proper ESD protection. Handle the device by the body, avoid touching the pins, and use an anti-static wrist strap or mat when handling the device. Also, ensure that the PCB and assembly process follow ESD-safe practices.

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TS482IDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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