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TS5MP646NYFPR - Texas Instruments

Description: 4-data lane, 2:1 MIPI switch (10-channel, 2:1 analog switch)

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PCB Footprints
TS5MP646NYFPR - Texas Instruments PCB footprint - BGA - BGA - YFP0036
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TS5MP646NYFPR - Texas Instruments  - 3D model - BGA - YFP0036
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TS5MP646NYFPR Details

  • Manufacturer Part Number:

    TS5MP646NYFPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-02-02

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    4

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Bandwidth-Nom:

    3000 MHz

  • Input Voltage-Max:

    3.6 V

  • JESD-30 Code:

    S-XBGA-B36

  • JESD-609 Code:

    e1

  • Length:

    2.6 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Off-state Isolation-Nom:

    20 dB

  • On-state Resistance Match-Nom:

    0.1 Ω

  • On-state Resistance-Max (Ron):

    9 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA36,6X6,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    1000 ns

  • Switch-on Time-Max:

    300000 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.6 mm

TS5MP646NYFPR Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow the PCB layout guidelines provided in the datasheet, including keeping the input and output traces short and away from noise sources, and using a solid ground plane to reduce EMI.
  • To ensure signal integrity, use a controlled impedance PCB design, keep the signal traces short and away from noise sources, and use a common mode filter or ferrite bead to reduce EMI. Additionally, use a termination resistor at the receiver end to match the impedance of the transmission line.
  • The maximum cable length supported by the TS5MP646NYFPR depends on the specific application and the type of cable used. As a general guideline, the device can support cable lengths up to 10 meters at data rates up to 6 Gbps. However, it is recommended to consult the datasheet and perform signal integrity simulations to determine the maximum cable length for a specific application.
  • To troubleshoot issues with the TS5MP646NYFPR, start by verifying the power supply voltage and ensuring that the device is properly configured. Check the signal integrity by monitoring the signal quality and checking for any signs of signal degradation. Use oscilloscopes or logic analyzers to debug the signal and identify any issues. Consult the datasheet and application notes for specific troubleshooting guidelines.
  • The TS5MP646NYFPR has a maximum junction temperature of 125°C. To ensure reliable operation, it is recommended to keep the device temperature below 100°C. Use thermal vias and thermal pads on the PCB to dissipate heat, and consider using a heat sink or thermal interface material to improve heat dissipation.

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TS5MP646NYFPR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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