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TS5MP646YFPR - Texas Instruments

Description: 4-data lane, 2:1 MIPI switch (10-channel, 2:1 analog switch)

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PCB Footprints
TS5MP646YFPR - Texas Instruments PCB footprint - BGA - BGA - YFP0036
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TS5MP646YFPR - Texas Instruments  - 3D model - BGA - YFP0036
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TS5MP646YFPR Details

  • Manufacturer Part Number:

    TS5MP646YFPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-02-02

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    3.9

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Bandwidth-Nom:

    3000 MHz

  • Input Voltage-Max:

    3.6 V

  • JESD-30 Code:

    S-XBGA-B36

  • JESD-609 Code:

    e1

  • Length:

    2.6 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Off-state Isolation-Nom:

    20 dB

  • On-state Resistance Match-Nom:

    0.1 Ω

  • On-state Resistance-Max (Ron):

    9 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA36,6X6,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    1000 ns

  • Switch-on Time-Max:

    300000 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.6 mm

TS5MP646YFPR Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it's recommended to use a 4-layer PCB with a solid ground plane, and to place thermal vias under the device to dissipate heat efficiently.
  • To ensure signal integrity, use controlled impedance traces, add series termination resistors, and consider using differential signaling. Also, follow the recommended routing guidelines in the datasheet.
  • The TS5MP646YFPR requires a specific power sequencing order to prevent damage. Power up VCC before VDD, and ensure that VCC is stable before applying VDD. Refer to the datasheet for the recommended power-up sequence.
  • The thermal shutdown feature is enabled by default. To handle it, monitor the TSD pin, which goes low when the device exceeds the thermal threshold. Implement a thermal management strategy, such as reducing power consumption or shutting down the device, to prevent damage.
  • The TS5MP646YFPR has built-in ESD protection, but it's still important to follow proper ESD handling procedures during manufacturing and assembly. Use ESD-protective packaging, wrist straps, and mats to prevent damage.

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TS5MP646YFPR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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