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TS5USBC412IYFFR - Texas Instruments

Description: Dual 2:1 USB 2.0 Mux/DeMux or Single Ended Cross Switch With 20-V/24-V OVP

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PCB Footprints
TS5USBC412IYFFR - Texas Instruments PCB footprint - BGA - BGA - YFF0012-C01-
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TS5USBC412IYFFR - Texas Instruments  - 3D model - BGA - YFF0012-C01-
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TS5USBC412IYFFR Details

  • Manufacturer Part Number:

    TS5USBC412IYFFR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-03-27

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    CROSS POINT SWITCH

  • Bandwidth-Nom:

    1200 MHz

  • JESD-30 Code:

    R-XBGA-B12

  • JESD-609 Code:

    e1

  • Length:

    1.598 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Off-state Isolation-Nom:

    90 dB

  • On-state Resistance Match-Nom:

    0.3 Ω

  • On-state Resistance-Max (Ron):

    9 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.625 mm

  • Signal Current-Max:

    0.1 A

  • Supply Current-Max (Isup):

    0.022 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    1000 ns

  • Switch-on Time-Max:

    250000 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.198 mm

TS5USBC412IYFFR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-speed PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm impedance-controlled traces for the USB signals.
  • To minimize jitter and ensure signal integrity, use a low-jitter clock source, keep the clock signal path as short as possible, and use a clock buffer or repeater if necessary. Additionally, use a high-quality USB connector and cable, and ensure that the PCB layout is optimized for signal integrity.
  • The TS5USBC412IYFFR supports USB 2.0, which has a maximum cable length of 3 meters (10 feet). However, the actual cable length may be limited by the specific application, signal quality, and noise tolerance.
  • The TS5USBC412IYFFR requires a 1.8-V to 3.3-V power supply. It's essential to use a low-dropout regulator (LDO) or a switching regulator to ensure a stable and noise-free power supply. Additionally, follow proper power management practices, such as using decoupling capacitors and minimizing power supply noise.
  • The TS5USBC412IYFFR has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate thermal management, such as using a heat sink, thermal vias, or a thermally conductive PCB material. Additionally, follow proper thermal design practices, such as minimizing thermal resistance and using thermal interface materials.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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