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TS5USBC412YFFT - Texas Instruments

Description: TEXAS INSTRUMENTS - TS5USBC412YFFT - USB Interface, Differential 2:1/1:2 Mux/Demux, USB 2.0, 2.3 V, 5.5 V, DSBGA, 12 Pins

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TS5USBC412YFFT - Texas Instruments PCB footprint - BGA - BGA - YFF0012-C01-
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TS5USBC412YFFT - Texas Instruments  - 3D model - BGA - YFF0012-C01-
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TS5USBC412YFFT Details

  • Manufacturer Part Number:

    TS5USBC412YFFT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-03-27

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    CROSS POINT SWITCH

  • Bandwidth-Nom:

    1200 MHz

  • JESD-30 Code:

    R-XBGA-B12

  • JESD-609 Code:

    e1

  • Length:

    1.598 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Off-state Isolation-Nom:

    90 dB

  • On-state Resistance Match-Nom:

    0.3 Ω

  • On-state Resistance-Max (Ron):

    9 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.625 mm

  • Signal Current-Max:

    0.1 A

  • Supply Current-Max (Isup):

    0.022 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    1000 ns

  • Switch-on Time-Max:

    250000 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.198 mm

TS5USBC412YFFT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVA883, which includes guidelines for signal routing, decoupling, and thermal management to ensure optimal performance and signal integrity.
  • To minimize jitter and ensure signal integrity, it's essential to follow the recommended PCB layout, use high-quality components, and implement proper signal routing and termination. Additionally, consider using a signal integrity analysis tool to simulate and optimize your design.
  • The TS5USBC412YFFT has an operating temperature range of -40°C to 85°C. While it can operate within this range, its performance may degrade at higher temperatures. It's essential to ensure proper thermal management and heat dissipation to maintain optimal performance.
  • Yes, the TS5USBC412YFFT can be used in a USB 2.0 application, but it will operate at a reduced speed. The device will automatically detect the USB 2.0 signal and adjust its performance accordingly. However, the device's power consumption and signal integrity may be affected, so it's essential to consult the datasheet and application notes for specific guidance.
  • To troubleshoot common issues with the TS5USBC412YFFT, start by verifying the PCB layout and signal routing, checking for signal integrity and jitter, and ensuring proper power supply and decoupling. Use oscilloscopes and signal analysis tools to identify the root cause of the issue. Consult the datasheet, application notes, and Texas Instruments' support resources for additional guidance.

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TS5USBC412YFFT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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