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TSB12LV01BPZT - Texas Instruments

Description: PZT (S-PQFP-G100)

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TSB12LV01BPZT - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PZT (S-PQFP-G100)
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TSB12LV01BPZT - Texas Instruments  - 3D model - Quad Flat Packages - PZT (S-PQFP-G100)
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TSB12LV01BPZT Details

  • Manufacturer Part Number:

    TSB12LV01BPZT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO REQUIRES 5V SUPPLY

  • Address Bus Width:

    8

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    49.152 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Transfer Rate-Max:

    50 MBps

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    4

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

TSB12LV01BPZT Frequently Asked Questions (FAQs)

  • A good PCB layout for the TSB12LV01BPZT involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • To ensure signal integrity, use controlled impedance traces, minimize trace lengths, and use termination resistors if necessary. Also, keep the signal traces away from noise sources and use shielding if possible.
  • The maximum cable length supported by the TSB12LV01BPZT depends on the specific application and signal frequency. As a general guideline, TI recommends keeping cable lengths under 10 meters for optimal performance.
  • Yes, the TSB12LV01BPZT can be used in a multi-point or daisy-chained configuration, but it's essential to follow TI's guidelines for bus loading and termination to ensure signal integrity.
  • To troubleshoot issues with the TSB12LV01BPZT, start by checking the power supply, signal integrity, and PCB layout. Use oscilloscopes and logic analyzers to debug the signals, and consult TI's application notes and support resources for guidance.

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TSB12LV01BPZT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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