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TSM101CDT - STMicroelectronics

Description: VOLTAGE AND CURRENT CONTROLLER

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TSM101CDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - 8 PINS - PLASTIC MICROPACKAGE (SO)
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TSM101CDT - STMicroelectronics  - 3D model - Small Outline Packages - 8 PINS - PLASTIC MICROPACKAGE (SO)
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TSM101CDT Details

  • Manufacturer Part Number:

    TSM101CDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    MICRO, PLASTIC, SO-8

  • Pin Count:

    8

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    80 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    32 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TSM101CDT Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure accurate temperature measurement, it's essential to calibrate the device, use a high-precision voltage reference, and minimize noise on the analog output lines. Additionally, the device should be operated within its specified temperature range, and the thermal pad should be properly connected to a heat sink or a large copper area on the PCB.
  • The maximum allowed voltage on the VCC pin is 5.5V. Exceeding this voltage may damage the device. It's recommended to use a voltage regulator or a voltage limiter to ensure the voltage remains within the specified range.
  • The TSM101CDT is rated for operation up to 150°C. However, the device's accuracy and reliability may degrade at high temperatures. It's essential to consult the datasheet and application notes for specific guidance on using the device in high-temperature environments.
  • The TSM101CDT provides an analog output voltage that's proportional to the temperature. This output can be connected to an analog-to-digital converter (ADC) on a microcontroller. The microcontroller can then read the ADC value and convert it to a temperature reading using the device's transfer function.

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TSM101CDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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