The recommended PCB footprint for the TSV250-130F-2 can be found in the Littelfuse application note AN9313, which provides a detailed layout and land pattern design guide.
To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, and to consider using a heat sink or thermal interface material to reduce the junction temperature.
Yes, the TSV250-130F-2 can be used in high-frequency applications, but it's recommended to consider the parasitic inductance and capacitance of the device, and to use a suitable PCB layout and decoupling capacitors to minimize noise and ringing.
The maximum surge current rating for the TSV250-130F-2 is 130A for 10ms, as specified in the datasheet. However, it's recommended to consult with Littelfuse application engineers for specific surge current requirements and to ensure the device is properly sized for the application.
Yes, the TSV250-130F-2 is compatible with lead-free soldering processes, and is RoHS compliant. However, it's recommended to follow the recommended soldering profile and temperature guidelines to ensure reliable assembly.
Trust Checks
This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
TSV250-130F-2 Overview
Use the download button to access the TSV250-130F-2 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TSV25,
or try a keyword search, such as Non-linear Resistors
