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TXBN0304RSVR - Texas Instruments

Description: Translation - Voltage Levels 4B Bidirec Auto-dir Sensing Translator

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PCB Footprints
TXBN0304RSVR - Texas Instruments PCB footprint - Other - Other - RSV0016A_2021
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3D Models
TXBN0304RSVR - Texas Instruments  - 3D model - Other - RSV0016A_2021
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TXBN0304RSVR Details

  • Manufacturer Part Number:

    TXBN0304RSVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-XQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    2.6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC16,.07X.1,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.55 mm

  • Supply Current-Max:

    0.01 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    0.9 V

  • Supply Voltage1-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.8 mm

TXBN0304RSVR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TXBN0304RSVR involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal design and management practices. This includes providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, it's recommended to derate the device's power handling capabilities according to the operating temperature.
  • The TXBN0304RSVR has built-in ESD protection, but it's still important to follow proper ESD handling and storage procedures to prevent damage. This includes using ESD-safe materials, grounding oneself before handling the device, and storing the device in ESD-safe packaging.
  • To troubleshoot issues with the TXBN0304RSVR, start by checking the device's operating conditions, such as voltage, current, and temperature. Verify that the device is properly soldered and that the PCB layout is correct. Use oscilloscopes and thermal imaging cameras to monitor the device's behavior and identify potential issues. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • When using the TXBN0304RSVR in a high-reliability or safety-critical application, it's essential to follow rigorous design and testing procedures. This includes performing thorough risk assessments, using redundant or fault-tolerant designs, and implementing multiple levels of protection against faults and failures. Additionally, ensure that the device is properly qualified and certified for the specific application.

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TXBN0304RSVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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