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TXU0101QDCKRQ1 - Texas Instruments

Description: Voltage Level Translator Unidirectional 1 Circuit 1 Channel 200Mbps SC-70-6 , 1.08V ~ 5.5V , -40°C ~ 125°C (TA)

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PCB Footprints
TXU0101QDCKRQ1 - Texas Instruments PCB footprint - Other - Other - DCK0006A_2025
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3D Models
TXU0101QDCKRQ1 - Texas Instruments  - 3D model - Other - DCK0006A_2025
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TXU0101QDCKRQ1 Details

  • Manufacturer Part Number:

    TXU0101QDCKRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    ENABLE HIGH

  • Count Direction:

    UNI/BIDIRECTIONAL

  • Family:

    TXU

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Load Capacitance (CL):

    5 pF

  • Logic IC Type:

    BUS TRANSCEIVER

  • Max I(ol):

    -0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.0055 mA

  • Prop. Delay@Nom-Sup:

    96 ns

  • Propagation Delay (tpd):

    8 ns

  • Schmitt Trigger:

    YES

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    0.44 V

  • Supply Voltage-Nom (Vsup):

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    1.25 mm

TXU0101QDCKRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good layout practices, such as keeping the signal paths short, using a solid ground plane, and minimizing noise coupling. Additionally, ensure the device is placed near the connector to reduce signal loss.
  • The TXU0101QDCKRQ1 has a thermal pad that must be connected to a solid ground plane or a thermal relief pattern to dissipate heat. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Follow the recommended thermal design guidelines in the datasheet.
  • The maximum cable length supported by the TXU0101QDCKRQ1 depends on the specific application and the type of cable used. As a general guideline, the device can support cable lengths up to 3 meters (10 feet) for USB 2.0 and 1 meter (3.3 feet) for USB 3.2 Gen 1. However, it's recommended to consult the USB specification and perform signal integrity analysis for longer cable lengths.
  • To configure the TXU0101QDCKRQ1 for USB 3.2 Gen 2 operation, ensure that the device is properly powered, and the correct pin configurations are set. Refer to the datasheet for specific pin settings and configuration options. Additionally, consult the USB 3.2 specification for Gen 2 operation requirements.
  • The TXU0101QDCKRQ1 has built-in ESD protection and latch-up prevention mechanisms. However, it's still essential to follow proper ESD handling procedures during device handling and assembly. Ensure that the device is properly grounded, and use ESD-protective materials and tools to prevent damage.

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TXU0101QDCKRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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