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UC1832J - Texas Instruments

Description: cdip

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UC1832J - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - J0014A
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UC1832J - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - J0014A
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UC1832J Details

  • Manufacturer Part Number:

    UC1832J

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    UNDER AND OVER-VOLTAGE FAULT ALERT WITH PROGRAMMABLE DELAY

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    4.5 V

  • JESD-30 Code:

    R-GDIP-T14

  • JESD-609 Code:

    e0

  • Length:

    19.56 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.45 A

  • Output Voltage-Min:

    1.98 V

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP14,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Max (Vsup):

    36 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Trim/Adjustable Output:

    YES

  • Width:

    7.62 mm

UC1832J Frequently Asked Questions (FAQs)

  • The UC1832J is a high-frequency device, and proper layout and placement are crucial for its operation. TI recommends a 4-layer PCB with a solid ground plane, and the device should be placed close to the input capacitors. The output inductor and diode should be placed close to the device, and the output capacitor should be placed close to the load. A good layout will help reduce EMI and improve efficiency.
  • The input capacitor should be a low-ESR ceramic capacitor with a voltage rating of at least 1.5 times the input voltage. The output capacitor should be a low-ESR electrolytic capacitor with a voltage rating of at least 1.5 times the output voltage. The capacitance value should be chosen based on the output ripple requirement and the switching frequency. TI recommends using capacitors with a ripple current rating of at least 2 times the output current.
  • The UC1832J has an operating temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. TI recommends derating the output current and voltage at high temperatures to ensure reliable operation.
  • To troubleshoot issues with the UC1832J, start by checking the input and output voltage levels, and the switching frequency. Use an oscilloscope to check for oscillations or ringing on the output voltage. Check the layout and placement of the components, and ensure that the input and output capacitors are properly selected. Also, check the output inductor and diode for saturation or overheating. If the issue persists, consult the TI application notes and technical support resources for further guidance.
  • Yes, the UC1832J can be used in a synchronous rectification configuration. However, this requires additional components, such as a synchronous rectifier FET and a driver IC. TI provides application notes and reference designs for synchronous rectification configurations using the UC1832J.

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UC1832J Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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