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UC2950TG3 - Texas Instruments

Description: TEXAS INSTRUMENTS - UC2950TG3 . - HALF-BRIDGE SWITCH, 2950, TO/SOT-5

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UC2950TG3 - Texas Instruments PCB footprint - Other - Other - KC(R-PSFM-T5)
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UC2950TG3 Details

  • Manufacturer Part Number:

    UC2950TG3

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SFM

  • Package Description:

    TO-220, 5 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Built-in Protections:

    THERMAL

  • Driver Number of Bits:

    1

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PSFM-T5

  • JESD-609 Code:

    e3

  • Length:

    10.16 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Characteristics:

    3-STATE

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Current-Max:

    4 A

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-220

  • Package Equivalence Code:

    SIP5,.1,67TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.7 mm

  • Supply Current-Max:

    36 mA

  • Supply Voltage-Max:

    8 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.7 mm

  • Terminal Position:

    SINGLE

  • Turn-off Time:

    2 µs

  • Turn-on Time:

    0.5 µs

  • Width:

    8.51 mm

UC2950TG3 Frequently Asked Questions (FAQs)

  • The UC2950TG3 is a high-frequency device, and proper layout and placement are crucial for its operation. TI recommends a 4-layer PCB with a solid ground plane, and the device should be placed close to the input capacitors. The output inductor and diode should be placed close to the device, and the output capacitor should be placed close to the load. A good rule of thumb is to keep the high-frequency loops as small as possible.
  • The input capacitor should have a low ESR and be able to handle the input ripple current. A ceramic capacitor with an X7R or X5R dielectric is recommended. The output capacitor should also have a low ESR and be able to handle the output ripple current. A ceramic or film capacitor with a low ESR is recommended. The capacitor values should be chosen based on the desired output voltage ripple and the switching frequency.
  • The maximum ambient temperature for the UC2950TG3 is 85°C. However, the device can operate up to 125°C junction temperature. The ambient temperature should be derated based on the power dissipation and the thermal resistance of the device.
  • The power dissipation of the UC2950TG3 can be calculated using the following formula: Pd = (Vin * Iin) + (Vout * Iout) + (fsw * Coss * Vin^2). Where Vin is the input voltage, Iin is the input current, Vout is the output voltage, Iout is the output current, fsw is the switching frequency, and Coss is the output capacitance. The power dissipation should be derated based on the ambient temperature and the thermal resistance of the device.
  • The recommended switching frequency for the UC2950TG3 is between 200 kHz and 500 kHz. However, the switching frequency can be adjusted based on the specific application requirements and the trade-off between efficiency and size.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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