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UC3827DW-2 - Texas Instruments

Description: Buck Current/Voltage Fed Push-Pull PWM Controllers

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UC3827DW-2 - Texas Instruments - PCB symbol
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PCB Footprints
UC3827DW-2 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW (R-PDSO-G24)
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3D Models
UC3827DW-2 - Texas Instruments - 3D model - Small Outline Packages - DW (R-PDSO-G24)
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UC3827DW-2 Details

  • Manufacturer Part Number:

    UC3827DW-2

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    CAN ALSO WORK IN CURRENT MODE

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    9.5 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    15.4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max (Isup):

    1 mA

  • Supply Voltage-Max (Vsup):

    20 V

  • Supply Voltage-Min (Vsup):

    8.8 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    PUSH-PULL

  • Switching Frequency-Max:

    500 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

UC3827DW-2 Frequently Asked Questions (FAQs)

  • The UC3827DW-2 is a high-frequency device, and proper layout and placement are crucial to minimize EMI and noise. TI recommends a 4-layer PCB with a solid ground plane, and placing the device close to the input capacitors and output inductors. Additionally, keep the high-current paths short and use a common ground point for the input and output stages.
  • The UC3827DW-2's voltage feedback loop requires compensation to ensure stability. TI recommends using a type-III compensation network, which includes a series RC network and a parallel RC network. The values of the resistors and capacitors depend on the specific application and can be calculated using TI's compensation calculator tool.
  • The UC3827DW-2 can tolerate a maximum input voltage ripple of 10% of the nominal input voltage. Exceeding this limit may cause the device to malfunction or oscillate. It's essential to ensure that the input voltage is well-regulated and filtered to prevent excessive ripple.
  • The UC3827DW-2 has built-in overcurrent protection, but it's still essential to add external protection circuitry to prevent damage from overvoltage and overcurrent conditions. TI recommends using a voltage supervisor IC to monitor the input voltage and shut down the device if it exceeds the maximum rating. Additionally, a current-sensing resistor and a fuse can be used to detect and respond to overcurrent conditions.
  • The UC3827DW-2 can dissipate a significant amount of power, especially at high input voltages and output currents. TI recommends using a heat sink with a thermal resistance of less than 10°C/W, and ensuring good airflow around the device. Additionally, using thermal interface material and applying a thin layer of thermal grease can help to improve heat transfer.

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UC3827DW-2 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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