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UC39431N - Texas Instruments

Description: Texas Instruments UC39431N, Adjustable Series Voltage Reference 2.4 - 36V, 0.4% 8-Pin, PDIP

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PCB Footprints
UC39431N - Texas Instruments PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - P (R-PDIP-T8)
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3D Models
UC39431N - Texas Instruments  - 3D model - Dual-In-Line Packages - P (R-PDIP-T8)
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UC39431N Details

  • Manufacturer Part Number:

    UC39431N

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    DIP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    PROGRAMMABLE TO PROVIDE REGULATED VOLTAGES OF 2.82V, 3.12V, 5.1V, 7.8V, 10.42V, 12.24V

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e4

  • Length:

    9.78 mm

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    0.05 A

  • Output Voltage-Max:

    36 V

  • Output Voltage-Min:

    2.3 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.33 mm

  • Supply Voltage-Max (Vsup):

    36 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Trim/Adjustable Output:

    YES

  • Width:

    7.62 mm

UC39431N Frequently Asked Questions (FAQs)

  • TI recommends a compact layout with minimal trace lengths, using a solid ground plane, and placing the IC close to the input capacitors. Additionally, ensure that the high-current paths are separated from the low-current paths, and use shielding or guard rings to reduce EMI.
  • Choose low-ESR, high-frequency capacitors (e.g., ceramic or film capacitors) with a voltage rating above the maximum input voltage. Consider the capacitor's ripple current rating, temperature coefficient, and physical size. A good starting point is to use 10-22 μF capacitors with a voltage rating of 25-50 V.
  • The UC39431N can deliver up to 3 A of output current. However, the maximum output current is dependent on the input voltage, output voltage, and thermal considerations. Ensure that the design takes into account the IC's thermal limitations, and consider adding heat sinks or thermal management if necessary.
  • The UC39431N has built-in OVP and UVP features. For OVP, connect a resistor divider network to the VSENSE pin to set the overvoltage threshold. For UVP, connect a resistor divider network to the VSENSE pin and the UVLO pin to set the undervoltage threshold. Ensure that the resistors are chosen to provide the desired voltage threshold and hysteresis.
  • The UC39431N has a high power density, so thermal design is crucial. Ensure good airflow, use a heat sink with a thermal resistance of < 10°C/W, and apply thermal interface material (TIM) to the heat sink. Consider using a thermal pad or thermal tape to improve heat transfer. Monitor the IC's junction temperature (TJ) and ensure it stays within the recommended operating range.

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UC39431N Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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