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UCC24636DBVT - Texas Instruments

Description: Synchronous Rectifier Controller With Ultra-Low Standby Current

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PCB Footprints
UCC24636DBVT - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV0006A
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3D Models
UCC24636DBVT - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV0006A
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UCC24636DBVT Details

  • Manufacturer Part Number:

    UCC24636DBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2016-03-15

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE FROM 5 TO 24V

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • Input Voltage-Max:

    28 V

  • Input Voltage-Min:

    3.75 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max (Vsup):

    28 V

  • Supply Voltage-Min (Vsup):

    3.75 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    130 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

UCC24636DBVT Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to have a solid ground plane on the bottom layer of the PCB, and to use thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the component placement and routing symmetrical can help reduce thermal gradients.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe junction temperature.
  • For EMI filtering and noise reduction, consider using a pi-filter configuration with a common-mode choke and capacitors. Additionally, ensure that the layout is designed to minimize loop areas and that the device is placed close to the power source to reduce noise coupling.
  • To optimize the design for low power consumption, consider using a low-dropout regulator (LDO) or a switching regulator with a high power conversion efficiency. Additionally, minimize the quiescent current by selecting components with low standby current and using power gating techniques.
  • Critical parameters to monitor for fault detection and protection include input voltage, output voltage, output current, and temperature. Implementing overvoltage protection, undervoltage protection, and overcurrent protection can help prevent damage to the device and ensure reliable operation.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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