SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Screening Level:
AEC-Q100
Seated Height-Max:
1.1 mm
Supply Current-Max (Isup):
20 mA
Supply Voltage-Nom (Vsup):
15 V
Surface Mount:
YES
Switcher Configuration:
PUSH-PULL
Switching Frequency-Max:
1200 kHz
Terminal Finish:
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
3 mm
UCC25800AQDGNQ1 Frequently Asked Questions (FAQs)
A good PCB layout for the UCC25800AQDGNQ1 involves keeping the input and output stages separate, using a solid ground plane, and minimizing the length of the traces between the device and the load. TI provides a recommended PCB layout in the application note SLUA623.
Proper thermal management involves providing a heat sink or thermal pad to dissipate heat, ensuring good airflow, and keeping the device away from heat sources. The thermal pad should be connected to a copper plane on the PCB to dissipate heat efficiently.
The recommended input capacitor value is 10uF to 22uF, and the type should be a low-ESR ceramic capacitor, such as X5R or X7R, to minimize voltage ripple and ensure stable operation.
To troubleshoot issues, check the PCB layout, ensure proper decoupling, and verify the input and output voltage levels. Use an oscilloscope to observe the waveforms and identify any signs of oscillation or instability. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
Yes, the UCC25800AQDGNQ1 is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard and is manufactured using a qualified process. However, additional testing and validation may be required for specific applications.
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
