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UCC27200DRMT - Texas Instruments

Description: Gate Drivers 120V Boot 3-A Peak HF HS/LS Driver

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UCC27200DRMT - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - DRM (S-PVSON-N8)
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3D Models
UCC27200DRMT - Texas Instruments  - 3D model - Small Outline No-lead - DRM (S-PVSON-N8)
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UCC27200DRMT Details

  • Manufacturer Part Number:

    UCC27200DRMT

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SON

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Built-in Protections:

    UNDER VOLTAGE

  • Driver Number of Bits:

    2

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    140 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Current-Max:

    3 A

  • Output Peak Current Limit-Nom:

    3 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.15,32

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    4 mA

  • Supply Voltage-Max:

    8 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

UCC27200DRMT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLUA623, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The selection of external components depends on the specific application and operating conditions. Texas Instruments provides guidelines and recommendations for component selection in the datasheet and application notes, such as SLUA623 and SLUA624. Additionally, the TI Power Stage Designer tool can be used to simulate and optimize the design.
  • The maximum junction temperature (Tj) of the UCC27200DRMT is 150°C. To ensure the device stays within the safe operating range, it's essential to provide adequate heat sinking, use a thermal interface material, and follow the recommended PCB layout and thermal management guidelines in the application notes.
  • Troubleshooting issues with the UCC27200DRMT requires a systematic approach. Start by verifying the PCB layout and component selection, then check the input and output voltage waveforms using an oscilloscope. Consult the datasheet and application notes for guidance on troubleshooting common issues, and consider using TI's online support resources, such as the E2E forum, for additional assistance.
  • Yes, the UCC27200DRMT is compatible with lead-free soldering. Texas Instruments recommends following the JEDEC standard J-STD-020D for lead-free soldering, with a peak reflow temperature of 260°C and a time above 217°C of 30 seconds maximum.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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