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UCC27201DR - Texas Instruments

Description: 120V Boot, 3-A Peak, High Frequency, High-Side/Low-Side Driver

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UCC27201DR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D-(R-PDSO-G8)
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UCC27201DR - Texas Instruments  - 3D model - Small Outline Packages - D-(R-PDSO-G8)
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UCC27201DR Details

  • Manufacturer Part Number:

    UCC27201DR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    140 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Peak Current Limit-Nom:

    3 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage-Max:

    17 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.05 µs

  • Turn-on Time:

    0.05 µs

  • Width:

    3.9 mm

UCC27201DR Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27201DR involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing loop areas to reduce EMI. TI provides a recommended layout in the datasheet and application notes.
  • Choose external components based on the specific requirements of your application, such as output voltage, current, and frequency. TI provides guidelines and equations in the datasheet to help with component selection. You can also use online tools and simulation software to aid in the design process.
  • The UCC27201DR has a maximum junction temperature of 150°C. Ensure reliable operation by providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device within the recommended operating temperature range. TI provides thermal resistance data in the datasheet to aid in thermal design.
  • Troubleshoot issues by checking the PCB layout, component selection, and circuit configuration. Verify that the input voltage, output voltage, and switching frequency are within the recommended ranges. Use oscilloscopes and other diagnostic tools to identify and isolate the problem. TI provides application notes and technical support to aid in troubleshooting.
  • In high-reliability or safety-critical applications, ensure that the UCC27201DR is used within its recommended operating conditions and that the system is designed with adequate margins. Follow TI's guidelines for fault detection and protection, and consider using redundant or fault-tolerant designs. Additionally, consult relevant industry standards and regulations for specific requirements.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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