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UCC27321DGNR - Texas Instruments

Description: Driver 9A 1-OUT Lo Side Inv 8-Pin HVSSOP EP T/R

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UCC27321DGNR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN (S-PDSO-G8)-
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UCC27321DGNR - Texas Instruments  - 3D model - Small Outline Packages - DGN (S-PDSO-G8)-
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UCC27321DGNR Details

  • Manufacturer Part Number:

    UCC27321DGNR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    9 A

  • Output Peak Current Limit-Nom:

    9 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.07 mm

  • Supply Current-Max:

    0.65 mA

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    4 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.07 µs

  • Turn-on Time:

    0.07 µs

  • Width:

    3 mm

UCC27321DGNR Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27321DGNR involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a separate analog and digital ground plane to minimize noise coupling.
  • To ensure proper biasing, make sure to connect the VCC pin to a stable voltage source, and the GND pin to a solid ground plane. The EN pin should be tied to a logic high or low depending on the desired state of the device. Additionally, the input and output capacitors should be properly sized and placed close to the device.
  • The UCC27321DGNR is designed to operate up to 100 kHz, but the actual operating frequency may vary depending on the specific application and PCB layout. It's recommended to consult the datasheet and application notes for more information.
  • To protect the UCC27321DGNR from overvoltage and overcurrent conditions, it's recommended to use external protection devices such as TVS diodes and current limiting resistors. Additionally, the device has built-in overcurrent protection, but it's still important to follow proper design and layout guidelines to ensure reliable operation.
  • The UCC27321DGNR has a thermal derating of 1.67 mW/°C, which means that the device's power rating decreases as the ambient temperature increases. It's recommended to consult the datasheet and thermal design guidelines to ensure reliable operation.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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