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UCC27322QDRQ1 - Texas Instruments

Description: Automotive 9A High Speed Low-Side MOSFET Driver With Enable

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UCC27322QDRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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UCC27322QDRQ1 - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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UCC27322QDRQ1 Details

  • Manufacturer Part Number:

    UCC27322QDRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia, Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    GATED SCHMITT TRIGGER

  • Interface IC Type:

    NAND GATE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    9 A

  • Output Peak Current Limit-Nom:

    9 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    4 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.075 µs

  • Turn-on Time:

    0.075 µs

  • Width:

    3.9 mm

UCC27322QDRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27322QDRQ1 involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper thermal management, it's recommended to attach a heat sink to the device, especially in high-power applications. The heat sink should be designed to dissipate heat efficiently, and thermal interface material (TIM) should be used to fill any gaps between the device and the heat sink.
  • The recommended input capacitor is a low-ESR ceramic capacitor with a value of 10uF to 22uF. The recommended output capacitor is a low-ESR ceramic capacitor with a value of 10uF to 47uF. The capacitor values may vary depending on the specific application and output voltage.
  • To troubleshoot issues with the UCC27322QDRQ1, start by checking the input voltage, output voltage, and current. Verify that the device is properly configured and that the input and output capacitors are properly sized. Check for any signs of overheating, and ensure that the device is properly thermally managed. If the issue persists, consult the datasheet and application notes for further guidance.
  • Operating the UCC27322QDRQ1 at high temperatures can reduce its reliability and lifespan. High temperatures can also affect the device's performance, including its output voltage regulation and efficiency. It's recommended to operate the device within its specified temperature range to ensure optimal performance and reliability.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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