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UCC27323DGNR - Texas Instruments

Description: Driver 4.5A 2-OUT Lo Side Inv 8-Pin HVSSOP EP T/R

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PCB Footprints
UCC27323DGNR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D
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UCC27323DGNR - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D
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UCC27323DGNR Details

  • Manufacturer Part Number:

    UCC27323DGNR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    4 A

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.07 mm

  • Supply Current-Max:

    0.45 mA

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.05 µs

  • Turn-on Time:

    0.04 µs

  • Width:

    3 mm

UCC27323DGNR Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27323DGNR involves keeping the input and output traces short and separate, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a low-ESR capacitor for the output filter capacitor.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are properly selected and placed. Additionally, the device's compensation pin (COMP) should be properly connected to the output voltage divider to ensure stability.
  • The UCC27323DGNR has an operating ambient temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade if operated at extreme temperatures for extended periods.
  • Yes, the UCC27323DGNR is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard for automotive applications and is suitable for use in high-reliability systems.
  • To troubleshoot issues with the UCC27323DGNR, start by checking the input and output voltages, ensuring they are within the recommended ranges. Verify that the device is properly connected and that the PCB layout is correct. Use an oscilloscope to check for oscillations or other anomalies. If issues persist, consult the datasheet and application notes for guidance.

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UCC27323DGNR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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