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UCC27324DGN - Texas Instruments

Description: Texas Instruments UCC27324DGN, Dual MOSFET Power Driver 4.5A, 4.5 → 15 V, Non-Inverting, 8-Pin MSOP

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PCB Footprints
UCC27324DGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - dgn 8-Pin HVSSOP
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UCC27324DGN - Texas Instruments  - 3D model - Small Outline Packages - dgn 8-Pin HVSSOP
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UCC27324DGN Details

  • Manufacturer Part Number:

    UCC27324DGN

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    4 A

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.07 mm

  • Supply Current-Max:

    0.75 mA

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.05 µs

  • Turn-on Time:

    0.04 µs

  • Width:

    3 mm

UCC27324DGN Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27324DGN involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a Kelvin connection for the output voltage sense pins to minimize noise and improve accuracy.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the output capacitor is properly sized and placed, and that the input voltage is within the recommended range. It's also important to decouple the input voltage with a capacitor and to use a low-ESR output capacitor.
  • The UCC27324DGN is rated for operation from -40°C to 125°C, but the maximum ambient temperature range depends on the specific application and the device's power dissipation. It's recommended to derate the device's power dissipation according to the ambient temperature to ensure reliable operation.
  • Yes, the UCC27324DGN is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard for automotive applications and is also suitable for use in industrial and medical applications that require high reliability.
  • To troubleshoot issues with the UCC27324DGN, start by checking the input voltage, output voltage, and output current. Verify that the component values and PCB layout meet the recommended guidelines. Use an oscilloscope to check for noise and oscillations on the output voltage. If the issue persists, consult the datasheet and application notes for further guidance.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image UCC27324DGNG4 Texas Instruments

Buffer/Inverter Based MOSFET Driver, 4A, BICMOS, PDSO8