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UCC27325DGNR - Texas Instruments

Description: Driver 4.5A 2-OUT Lo Side Inv/Non-Inv 8-Pin HVSSOP EP T/R

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UCC27325DGNR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D
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UCC27325DGNR - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D
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UCC27325DGNR Details

  • Manufacturer Part Number:

    UCC27325DGNR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    4 A

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.07 mm

  • Supply Current-Max:

    0.6 mA

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.05 µs

  • Turn-on Time:

    0.04 µs

  • Width:

    3 mm

UCC27325DGNR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLUA623, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The UCC27325DGNR has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via array or a copper pour with multiple vias can be used to connect the thermal pad to the thermal plane. Additionally, the PCB should be designed to minimize thermal resistance and ensure good airflow around the device.
  • The maximum allowed voltage on the input pins of the UCC27325DGNR is 6V, which is higher than the recommended operating voltage of 5V. However, it's essential to ensure that the input voltage does not exceed 6V to prevent damage to the device.
  • Yes, the UCC27325DGNR is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard for automotive applications and is suitable for use in harsh environments. However, it's essential to follow the recommended operating conditions and design guidelines to ensure reliable operation.
  • Texas Instruments provides a troubleshooting guide in the application note SLUA624, which includes a step-by-step approach to identifying and resolving common issues with the UCC27325DGNR. The guide covers topics such as output voltage errors, oscillations, and thermal issues.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image UCC27325DGN Texas Instruments

Buffer/Inverter Based MOSFET Driver, 4A, BICMOS, PDSO8