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UCC27423MDREP - Texas Instruments

Description: DUAL 4-A HIGH-SPEED LOW-SIDE MOSFET DRIVER WITH ENABLE

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UCC27423MDREP - Texas Instruments - PCB symbol
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UCC27423MDREP Details

  • Manufacturer Part Number:

    UCC27423MDREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    4 A

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1.35 mA

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.055 µs

  • Turn-on Time:

    0.06 µs

  • Width:

    3.9 mm

UCC27423MDREP Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27423MDREP involves keeping the input and output stages separate, using a solid ground plane, and minimizing the length of the high-frequency traces. TI provides a recommended PCB layout in the application note SLUA623.
  • Proper thermal management involves attaching a heat sink to the device, ensuring good airflow, and keeping the ambient temperature within the recommended range. The thermal resistance of the device is 3.5°C/W, and the maximum junction temperature is 150°C.
  • A pi-filter configuration with a series inductor and shunt capacitors is recommended to filter out high-frequency noise and ensure stable operation. The filter values depend on the specific application and input voltage.
  • Troubleshooting involves checking the PCB layout, ensuring proper decoupling, and verifying the input and output voltage levels. Oscillations can be caused by inadequate decoupling, poor PCB layout, or incorrect component values. Consult the TI application notes and technical support for guidance.
  • Key considerations for EMI and EMC compliance include using a shielded enclosure, minimizing radiated emissions, and ensuring conducted emissions are within regulatory limits. Follow TI's EMI and EMC guidelines and consult relevant industry standards.

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UCC27423MDREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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