SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.1 mm
Supply Current-Max:
0.175 mA
Supply Voltage-Max:
18 V
Supply Voltage-Min:
4.5 V
Supply Voltage-Nom:
12 V
Surface Mount:
YES
Technology:
BICMOS
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Turn-off Time:
0.023 µs
Turn-on Time:
0.023 µs
Width:
3 mm
UCC27525DGN Frequently Asked Questions (FAQs)
A good PCB layout for the UCC27525DGN involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing trace lengths and loop areas. TI provides a recommended PCB layout in the datasheet and application notes.
To ensure the UCC27525DGN operates within its SOA, monitor the device's junction temperature, input voltage, and output current. Use thermal design and layout techniques to keep the junction temperature below 150°C. Also, ensure the input voltage is within the recommended range (4.5V to 18V) and the output current is within the specified maximum rating (2A).
When selecting the output inductor and capacitor, consider the desired output voltage ripple, inductor core loss, and capacitor ESR. Choose an inductor with a high saturation current rating and a capacitor with a low ESR to minimize losses. TI provides guidance on component selection in the datasheet and application notes.
The UCC27525DGN has a built-in OCP and SCP feature. To implement OCP, set the OCP threshold using the OCSET pin. For SCP, use the SCP pin to detect short-circuit conditions. TI provides detailed implementation guidelines in the datasheet and application notes.
To manage thermal performance, ensure good airflow around the device, use a heat sink if necessary, and follow TI's recommended thermal design guidelines. Monitor the device's junction temperature and adjust the thermal design accordingly.
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UCC27525DGN Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
