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UCC27531DBVR - Texas Instruments

Description: 2.5-A, 5-A, 35-VMAX VDD FET and IGBT Single Gate Driver

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PCB Footprints
UCC27531DBVR - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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3D Models
UCC27531DBVR - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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UCC27531DBVR Details

  • Manufacturer Part Number:

    UCC27531DBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia, Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    140 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Current-Max:

    5 A

  • Output Peak Current Limit-Nom:

    5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max:

    32 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.026 µs

  • Turn-on Time:

    0.026 µs

  • Width:

    1.6 mm

UCC27531DBVR Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27531DBVR involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing trace lengths and loops. TI provides a recommended PCB layout in the application note SLUA623.
  • The input capacitor should be chosen based on the input voltage ripple requirement, output current, and operating frequency. A general guideline is to use a capacitor with a capacitance value of at least 10uF, a voltage rating of 1.5 to 2 times the input voltage, and a low ESR (equivalent series resistance).
  • The maximum ambient temperature for the UCC27531DBVR is 85°C, but the device can operate up to 125°C junction temperature. However, the device's performance and reliability may degrade at higher temperatures, so it's essential to ensure proper thermal management.
  • Yes, the UCC27531DBVR can be used in a synchronous buck converter configuration. In this configuration, the internal high-side switch is used as the main switch, and an external low-side switch (e.g., a MOSFET) is used as the synchronous rectifier. This configuration can improve efficiency and reduce power losses.
  • The switching frequency of the UCC27531DBVR can be adjusted by connecting a resistor (RT) between the RT pin and the GND pin. The switching frequency (fSW) is inversely proportional to the value of RT. A smaller RT value results in a higher switching frequency.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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