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UCC27536DBVR - Texas Instruments

Description: 2.5-A, 5-A, 35-VMAX VDD FET and IGBT Single Gate Driver

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PCB Footprints
UCC27536DBVR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT-23_a
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3D Models
UCC27536DBVR - Texas Instruments  - 3D model - SOT23 (5-Pin) - SOT-23_a
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UCC27536DBVR Details

  • Manufacturer Part Number:

    UCC27536DBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    140 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    2.5 A

  • Output Peak Current Limit-Nom:

    5 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max:

    32 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.026 µs

  • Turn-on Time:

    0.026 µs

  • Width:

    1.6 mm

UCC27536DBVR Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27536DBVR involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper thermal management, it's recommended to attach a heat sink to the device, especially in high-power applications. The heat sink should be designed to dissipate heat efficiently, and thermal interface material (TIM) should be used to fill any gaps between the device and the heat sink.
  • When selecting input and output capacitors for the UCC27536DBVR, consider the voltage rating, capacitance value, and equivalent series resistance (ESR). The capacitors should be rated for the maximum input voltage and have a low ESR to minimize energy losses. X7R or X5R ceramic capacitors are recommended for their low ESR and high reliability.
  • To troubleshoot issues with the UCC27536DBVR, start by checking the PCB layout and ensuring that it meets the recommended layout guidelines. Verify that the input and output capacitors are properly selected and installed. Use an oscilloscope to measure the input and output waveforms, and check for signs of oscillation or instability. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • The UCC27536DBVR is a high-voltage, high-current device with a unique combination of features, including a wide input voltage range and a high-power density. Compared to other devices from Texas Instruments, the UCC27536DBVR has a higher maximum input voltage and a higher power rating, making it suitable for high-power applications such as server and telecom power supplies.

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UCC27536DBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image UCC27536DBV Texas Instruments

Half Bridge Based IGBT/MOSFET Driver, 5A, PDSO5