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UCC2801MDREP - Texas Instruments

Description: Enhanced Product Low-Power Bicmos Current-Mode Pwm

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UCC2801MDREP - Texas Instruments - PCB symbol
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UCC2801MDREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G8)_1
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UCC2801MDREP - Texas Instruments - 3D model - Small Outline Packages - D (R-PDSO-G8)_1
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UCC2801MDREP Details

  • Manufacturer Part Number:

    UCC2801MDREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    12 V

  • Input Voltage-Min:

    8 V

  • Input Voltage-Nom:

    10 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    5.075 V

  • Output Voltage-Min:

    4.925 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    30 mA

  • Supply Voltage-Max (Vsup):

    12 V

  • Supply Voltage-Min (Vsup):

    9.4 V

  • Supply Voltage-Nom (Vsup):

    10 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.905 mm

UCC2801MDREP Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC2801MDREP involves keeping the input and output stages separate, using a star-ground configuration, and placing the input and output capacitors close to the IC. Additionally, using a ground plane and minimizing trace lengths can help reduce EMI.
  • The choice of input and output capacitors for the UCC2801MDREP depends on the specific application requirements. Generally, low-ESR capacitors with a voltage rating above the maximum input voltage are recommended. A minimum capacitance of 10uF is recommended for the input capacitor, and 22uF for the output capacitor.
  • The maximum power dissipation of the UCC2801MDREP is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 2.5W at 25°C ambient temperature. However, this can be derated to 1.25W at 50°C ambient temperature.
  • The UCC2801MDREP has a built-in overcurrent protection feature that can be enabled by connecting a resistor between the OC pin and the GND pin. The value of the resistor determines the overcurrent threshold. A lower resistor value will trigger the overcurrent protection at a lower current level.
  • Yes, the UCC2801MDREP is a high-reliability device that is suitable for use in high-reliability applications. It is built with a robust design and has undergone rigorous testing to ensure its reliability. However, it is still important to follow proper design and manufacturing practices to ensure the reliability of the overall system.

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UCC2801MDREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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