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UCC2801QDREP - Texas Instruments

Description: Enhanced Product Low-Power Bicmos Current-Mode Pwm

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UCC2801QDREP Details

  • Manufacturer Part Number:

    UCC2801QDREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    12 V

  • Input Voltage-Min:

    8 V

  • Input Voltage-Nom:

    10 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    5.075 V

  • Output Voltage-Min:

    4.925 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    30 mA

  • Supply Voltage-Max (Vsup):

    12 V

  • Supply Voltage-Min (Vsup):

    9.4 V

  • Supply Voltage-Nom (Vsup):

    10 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.905 mm

UCC2801QDREP Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC2801QDREP involves keeping the high-frequency components (such as the transformer and the power MOSFETs) close together, using a solid ground plane, and keeping the input and output stages separate. Additionally, using a shielded transformer and placing the controller IC close to the transformer can help reduce EMI.
  • When choosing a transformer for the UCC2801QDREP, consider the output power, output voltage, and input voltage. The transformer's turns ratio should be chosen to achieve the desired output voltage. The transformer's power rating should be higher than the output power. Additionally, consider the transformer's leakage inductance, magnetizing inductance, and core losses.
  • When designing for thermal performance with the UCC2801QDREP, consider the IC's power dissipation, junction temperature, and thermal resistance. Ensure good airflow around the IC, use a heat sink if necessary, and consider the PCB's thermal conductivity. Also, ensure that the IC is soldered correctly to the PCB to minimize thermal resistance.
  • The UCC2801QDREP has a built-in overcurrent protection feature. To implement it, connect a sense resistor in series with the output inductor, and connect the sense resistor to the IC's CS pin. The IC will then monitor the current and shut down if it exceeds the set threshold. The threshold can be set by adjusting the sense resistor value.
  • When designing EMI filters for the UCC2801QDREP, consider the frequency range of the noise, the filter's insertion loss, and the filter's impedance. Use a common-mode choke and a differential-mode filter to reduce EMI. Ensure that the filter components are placed close to the IC and that the filter's impedance is matched to the IC's output impedance.

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UCC2801QDREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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