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UCC2803MDREP - Texas Instruments

Description: Enhanced Product Low-Power Bicmos Current-Mode Pwm

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UCC2803MDREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D
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UCC2803MDREP Details

  • Manufacturer Part Number:

    UCC2803MDREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    12 V

  • Input Voltage-Min:

    4 V

  • Input Voltage-Nom:

    10 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    4.06 V

  • Output Voltage-Min:

    3.94 V

  • Output Voltage-Nom:

    4 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    30 mA

  • Supply Voltage-Max (Vsup):

    12 V

  • Supply Voltage-Min (Vsup):

    4.1 V

  • Supply Voltage-Nom (Vsup):

    10 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.905 mm

UCC2803MDREP Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC2803MDREP involves keeping the high-frequency components (e.g., the transformer, diodes, and capacitors) close together, using a solid ground plane, and minimizing the length of the high-current paths. Additionally, it's recommended to use a shielded transformer and to keep the input and output stages separated.
  • When selecting a transformer for the UCC2803MDREP, consider the input voltage, output voltage, and power rating. Ensure the transformer's turns ratio matches the desired output voltage, and its power rating exceeds the maximum power required by the load. Also, consider the transformer's leakage inductance, magnetizing inductance, and core losses.
  • Thermal management is crucial for the UCC2803MDREP. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Monitor the device's junction temperature (TJ) and ensure it stays within the recommended range (typically -40°C to 150°C). Also, consider the thermal resistance of the PCB and the device's package.
  • To optimize the feedback loop, ensure the compensation network is properly designed to stabilize the loop. Choose the right compensation components (e.g., resistors, capacitors) based on the desired bandwidth, phase margin, and gain margin. Also, consider the effects of component tolerances and temperature variations on the loop's stability.
  • Common pitfalls to avoid when designing with the UCC2803MDREP include: inadequate PCB layout, insufficient decoupling, incorrect transformer selection, poor thermal management, and inadequate feedback loop compensation. Additionally, ensure proper input and output filtering, and avoid overloading the device or exceeding its recommended operating conditions.

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UCC2803MDREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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