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UCC28051DG4 - Texas Instruments

Description: Power Factor Correction - PFC for low-med pwr app w/IEC1000-3-2 cmplnc

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UCC28051DG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A  SOIC
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UCC28051DG4 - Texas Instruments  - 3D model - Small Outline Packages - D0008A  SOIC
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UCC28051DG4 Details

  • Manufacturer Part Number:

    UCC28051DG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Mexico, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    10 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.75 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    4 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    200 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

UCC28051DG4 Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the UCC28051DG4 involves keeping the high-frequency components (such as the switching node and the bootstrap capacitor) close to the IC, and using a solid ground plane to reduce EMI. The datasheet provides a recommended layout diagram, and TI also provides a layout guide application note (SLUA623) that provides more detailed guidance.
  • The bootstrap capacitor value depends on the specific application requirements, such as the switching frequency, output voltage, and current. A general rule of thumb is to choose a capacitor with a value between 10nF to 100nF. TI provides a bootstrap capacitor selection guide in the datasheet, and also recommends using the WEBENCH Power Designer tool to help with component selection.
  • The maximum allowed voltage on the VCC pin is 18V, but it's recommended to keep it below 15V to ensure reliable operation. Exceeding the maximum voltage can cause damage to the IC.
  • TI provides a detailed application note (SLUA622) that covers the recommended biasing and configuration for the UCC28051DG4. The note provides guidance on setting the correct voltage levels, resistor values, and capacitor values for the specific application requirements.
  • The UCC28051DG4 has a maximum junction temperature of 150°C. To ensure it doesn't overheat, it's recommended to provide adequate heat sinking, such as using a thermal pad or a heat sink, and to keep the IC away from other heat sources. TI also provides thermal design guidelines in the datasheet and application notes.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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