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UCC283TDKTTT-5 - Texas Instruments

Description: Linear Voltage Regulator IC Positive Fixed 1 Output 3A DDPAK/TO-263-3

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UCC283TDKTTT-5 - Texas Instruments PCB footprint - Other - Other - KTT(R-PSFM-G3)
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UCC283TDKTTT-5 Details

  • Manufacturer Part Number:

    UCC283TDKTTT-5

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.6 V

  • Dropout Voltage1-Nom:

    0.4 V

  • Input Voltage Absolute-Max:

    9 V

  • Input Voltage-Max:

    9 V

  • Input Voltage-Min:

    5.15 V

  • JESD-30 Code:

    R-PSSO-G3

  • JESD-609 Code:

    e3

  • Length:

    10.16 mm

  • Line Regulation-Max:

    0.01%

  • Load Regulation-Max(%):

    0.02%

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -55 °C

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    3 A

  • Output Voltage1-Max:

    5.125 V

  • Output Voltage1-Min:

    4.875 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-263

  • Package Equivalence Code:

    SMSIP3H,.55TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    4.83 mm

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2.5%

  • Width:

    9.015 mm

UCC283TDKTTT-5 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. The datasheet provides some guidelines, but a more detailed application note from TI provides additional recommendations.
  • To ensure reliable start-up and shutdown, it's essential to follow the recommended power sequencing and voltage ramp rates. The datasheet provides guidelines for power-up and power-down sequences, and TI's application notes provide additional recommendations for specific use cases.
  • To minimize EMI and RFI, it's crucial to follow good PCB layout practices, such as separating analog and digital grounds, using shielding, and minimizing loop areas. TI's application notes and whitepapers provide additional guidance on EMI and RFI mitigation techniques.
  • To optimize the UCC283TDKTTT-5 for low standby power consumption, it's essential to use the device's low-power modes, such as the 'shutdown' mode, and to minimize the number of active circuits during standby. The datasheet provides information on the device's power modes, and TI's application notes provide additional guidance on power optimization techniques.
  • To ensure accurate testing and measurement, it's essential to use the recommended test equipment and techniques, such as using a high-impedance probe for voltage measurements and a current probe for current measurements. TI's application notes and datasheet provide additional guidance on test and measurement techniques.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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