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UCC28C40DGKR - Texas Instruments

Description: BiCMOS Low-Power Current Mode PWM Controller

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UCC28C40DGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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UCC28C40DGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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UCC28C40DGKR Details

  • Manufacturer Part Number:

    UCC28C40DGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES IN CURRENT MODE

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    12 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    18 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    3 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

UCC28C40DGKR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the thermal pad clear of any components or traces.
  • To ensure reliable start-up, ensure that the input voltage rises monotonically and does not droop during start-up. A soft-start circuit can be used to limit the inrush current and prevent voltage droop. Additionally, ensure that the output voltage is properly decoupled with a capacitor to prevent oscillations.
  • The recommended input capacitor value is 10uF to 22uF, with a voltage rating of 50V or higher. A low-ESR ceramic capacitor such as X5R or X7R is recommended. Avoid using electrolytic capacitors as they may not provide sufficient ripple current capability.
  • The compensation network can be optimized by using the TI's Power Stage Designer tool or by following the guidelines in the datasheet. A Type II compensation network is recommended, with a zero at 1/3 to 1/2 of the switching frequency and a pole at 1/2 to 2/3 of the switching frequency.
  • The maximum allowed output voltage ripple is 1% of the nominal output voltage. Exceeding this limit may affect the stability and reliability of the converter. A good design practice is to aim for an output voltage ripple of 0.5% or less.

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UCC28C40DGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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