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UCC38C40DGK - Texas Instruments

Description: BiCMOS Low-Power Current Mode PWM Controller

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UCC38C40DGK - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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UCC38C40DGK - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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UCC38C40DGK Details

  • Manufacturer Part Number:

    UCC38C40DGK

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES IN CURRENT MODE

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    12 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    18 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    3 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

UCC38C40DGK Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLUA121, which includes guidelines for component placement, trace routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The selection of the transformer depends on the specific application requirements, such as input voltage, output voltage, and power rating. Texas Instruments provides a transformer selection guide in the application note SLUA120, which includes guidelines for selecting the right transformer and calculating the transformer's turns ratio, inductance, and leakage inductance.
  • The UCC38C40DGK has a maximum junction temperature of 150°C. To ensure reliable operation, it is essential to provide adequate thermal management, such as heat sinks, thermal interfaces, and airflow. Texas Instruments provides thermal management guidelines in the datasheet and application notes, including calculations for thermal resistance and junction temperature.
  • The UCC38C40DGK does not have built-in OVP and UVP circuits. However, these can be implemented using external components, such as voltage supervisors, resistors, and zener diodes. Texas Instruments provides application notes and design examples that demonstrate how to implement OVP and UVP circuits for the UCC38C40DGK.
  • The UCC38C40DGK is designed to meet EMC standards, such as CISPR 22 and EN 55022. However, the overall EMC performance of the system depends on the PCB layout, component selection, and shielding. Texas Instruments provides EMC guidelines and design considerations in the application notes and datasheet.

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UCC38C40DGK Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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