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UCC37322DGNR - Texas Instruments

Description: Driver 9A 1-OUT Low Side Non-Inv 8-Pin HVSSOP EP T/R

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UCC37322DGNR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008G
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UCC37322DGNR - Texas Instruments  - 3D model - Small Outline Packages - DGN0008G
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UCC37322DGNR Details

  • Manufacturer Part Number:

    UCC37322DGNR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    9 A

  • Output Peak Current Limit-Nom:

    9 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.07 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    4 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.07 µs

  • Turn-on Time:

    0.07 µs

  • Width:

    3 mm

UCC37322DGNR Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC37322DGNR involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a separate analog and digital ground plane to minimize noise coupling.
  • To ensure proper powering and decoupling of the UCC37322DGNR, use a high-quality power supply with low ripple and noise, and add decoupling capacitors (e.g., 10uF and 100nF) close to the device's power pins. Also, ensure that the power supply voltage is within the recommended range of 4.5V to 18V.
  • The maximum allowable power dissipation for the UCC37322DGNR is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 2.5W at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the actual operating temperature and thermal resistance.
  • To troubleshoot issues with the UCC37322DGNR, start by verifying the PCB layout and component values, ensuring that they match the recommended values in the datasheet. Check for proper power supply decoupling, and ensure that the input and output capacitors are of sufficient value and quality. Use an oscilloscope to measure the output voltage and current, and check for any signs of oscillation or instability.
  • The UCC37322DGNR is a commercial-grade device, and its use in high-reliability or safety-critical applications may require additional qualification and testing. It's recommended to consult with Texas Instruments or a qualified reliability engineer to determine the suitability of the device for such applications.

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UCC37322DGNR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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